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工艺能力 | |
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硬板工艺能力
|
Item
|
Mass Production
Capacity
|
|
Layer Counts
|
1~16 layer
|
|
Material
|
FR-4, High Tg FR-4，CEM-1,
CEM-3, FR-1,
|
|
FR-2，XPC，Aluminum
Base, Teflon PTFE
|
|
Material Mixed Laminate
|
4 layers —8 layers
|
|
Maximum Size
|
610mm X 720mm
|
|
Board Outline Tolerance
|
±0.13mm
|
|
Board Thickness
|
0.40mm—3.20mm
|
|
Thickness Tolerance
( t≥0.8mm)
|
±8%
|
|
Thickness Tolerance
( t＜0.8mm)
|
±10%
|
|
Insulation Layer Thickness
|
0.10mm—6.00mm
|
|
Minimum Line
|
0.10mm
|
|
Minimum Space
|
0.10mm
|
|
Out Layer Copper Thickness
|
17um—140um
|
|
Inner Layer Copper
Thickness
|
17um—105um
|
|
Drilling Hole (Mechanical)
|
0.30mm—6.35mm
|
|
Finish Hole (Mechanical)
|
0.20mm—6.30mm
|
|
Diameter Tolerance
(Mechanical)
|
0.05mm
|
|
Registration (Mechanical)
|
0.075mm
|
|
Laser Hole
|
0.10mm (out source)
|
|
Aspect Ratio
|
10:1
|
|
Solder Mask Type
|
LPI, UV Cure
|
|
SMT Mini. Solder Mask
Width
|
0.10mm
|
|
Mini. Solder Mask
Clearance
|
0.05mm
|
|
Plug Hole Diameter
|
0.25mm—0.60mm
|
|
Impedance Control
Tolerance
|
±10%
|
|
Surface Finish
|
HASL, HASL Lead free,
Immersion Gold, OSP, Peelable mask,
Gold finger.
|
|
Electrolytic Gold,
Immersion tin， Immersion Silver, Carbon
ink,
|
|
软板工艺能力
| Material
|
Polyimide (PI) Polyester
(PET)
|
Remark
|
Layer count
|
1 up to 4 layer
1 up
to 2 layer
|
|
Min track
|
Single sided |
0.075mm (3mil)
|
|
| Min space |
Double sided
|
0.100mm (4mil)
|
|
| Min
hole |
Drill
|
0.3mm
|
|
| Punch |
0.5mm
|
|
| Dimension
Tolerance
|
Track width (W)
|
+/- 0.03mm
|
W ≤ 0.5mm
|
| Hole (H) |
+/- 0.05mm
|
H ≤ 1.5mm
|
| Pile distance (P) |
+/- 0.05mm
|
P ≤ 25mm
|
| Profile size (L) |
+/- 0.05mm
|
L ≤50mm
|
| Outline (C) |
+/- 0.075mm
|
C ≤ 5.0mm
|
Surface finish
|
Hard Ni/Au (Au 0.05~1.25μm),
Pb/Tin (2~20μm), HASL (only for PI) |
| Copper weight |
9 μm, 12μm, 18μm, 35μm,
70μm |
Insolated resistance
|
1000m ohm
|
IPC-TM-650 2, 6, 3, 2 |
Dielectric intensity
|
5 kv
|
IPC-TM-650 2,5,6,1
|
Surface resistance
|
5 x E12
|
2 x E15
|
IPC-TM-650 2,5,17 |
| Touch resistance |
1 x E15
|
1 x E15
|
IPC-TM-650 2,5,17 |
Dielectric constant
|
4.0 |
3.0 |
MIL-P-55617 |
| Coefficient of divergence |
0.04 |
0.03 |
MIL-P-55617 |
Peel-off intensity
|
1.0kg f/cm
|
1.2kg f/cm
|
IPC-TM-650 2,4,9 |
| Solder intensity |
300 ℃/10 sec
|
210 ℃/10 sec
|
IPC-TM-650 2,4,9 |
Flammability
|
94VTM-0 |
94VTM-0
|
UL 94 |
|
铝基板工艺能力
MPCB的制作能力（Capability of MPCB） |
材料
|
铝基板
|
备注及测试方法 |
层数
|
1-2层
|
|
最小线宽/线距
|
0.1 mm (4mil)
|
百倍镜 |
| 最小孔径 |
钻孔
|
φ 0.40 mm
|
百倍镜 |
| 冲孔 |
φ 2.0 mm |
百倍镜 |
| ****钻杯 |
φ 8.00 mm |
MIL-P-55617 |
| 尺寸公差 |
导线宽度
|
± 20%
|
IPC-TM-650 2,4,9 |
| 孔径 |
± 0.05 mm |
|
| 累积间距 |
± 0.10 mm |
|
| 外形公差 |
± 0.1 mm |
L ≤50 mm |
| 边间距 |
± 0.05 mm
|
C ≤5.0 mm |
| 表面处理 |
化学镀金 |
Au(0.03-0.10 um);Ni(1-6 um) |
X-RAY 机 |
| 喷纯锡 |
Sn(6-18 um) |
| 防氧化（OSP） |
0.2-0.8um |
| 焊接温度 |
满足无铅焊 |
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