Chinese
 
 
  Capability
Xinyahong Technology Company is a Group company based in Hong Kong with facilities in mainland China, formed in 1995, started from punching tool manufacture. With year's development, we have been into an enterprise who supplies PCB, FPC and punching tool.

Rigid PCB Production Capacity

Item
Mass Production Capacity
Layer Counts
1~16 layer
Material
FR-4, High Tg FR-4,CEM-1, CEM-3, FR-1,
FR-2,XPC,Aluminum Base, Teflon PTFE
Material Mixed Laminate
4 layers —8 layers
Maximum Size
610mm X 720mm
Board Outline Tolerance
±0.13mm
Board Thickness
0.40mm—3.20mm
Thickness Tolerance
( t≥0.8mm)
±8%
Thickness Tolerance
( t<0.8mm)
±10%
Insulation Layer Thickness
0.10mm—6.00mm
Minimum Line
0.10mm
Minimum Space
0.10mm
Out Layer Copper Thickness
17um—140um
Inner Layer Copper Thickness
17um—105um
Drilling Hole (Mechanical)
0.30mm—6.35mm
Finish Hole (Mechanical)
0.20mm—6.30mm
Diameter Tolerance (Mechanical)
0.05mm
Registration (Mechanical)
0.075mm
Laser Hole
0.10mm (out source)
Aspect Ratio
10:1
Solder Mask Type
LPI, UV Cure
SMT Mini. Solder Mask Width
0.10mm
Mini. Solder Mask Clearance
0.05mm
Plug Hole Diameter
0.25mm—0.60mm
Impedance Control Tolerance
±10%
Surface Finish
HASL, HASL Lead free, Immersion Gold, OSP, Peelable mask, Gold finger.
Electrolytic Gold, Immersion tin, Immersion Silver, Carbon ink,
Capability of Flexible circuits

Material
Polyimide (PI)      Polyester (PET)
Remark
Layer count
1 up to 4 layer      1 up to 2 layer
 
Min track
Single sided
0.075mm (3mil)
 
Min space Double sided
0.100mm (4mil)
 
Min hole Drill
0.3mm
 
Punch
0.5mm
 
Dimension

Tolerance

Track width (W)
+/- 0.03mm
W ≤ 0.5mm
Hole (H)

+/- 0.05mm
H ≤ 1.5mm
Pile distance (P)
+/- 0.05mm
P ≤ 25mm
Profile size (L)
+/- 0.05mm
L ≤50mm
Outline (C)
+/- 0.075mm
C ≤ 5.0mm

Surface finish
Hard Ni/Au (Au 0.05~1.25μm), Pb/Tin (2~20μm), HASL (only for PI)
Copper weight 9 μm, 12μm, 18μm, 35μm, 70μm
Insolated resistance
1000m ohm
IPC-TM-650 2, 6, 3, 2
Dielectric intensity
5 kv
IPC-TM-650 2,5,6,1
Surface resistance
5 x E12
2 x E15
IPC-TM-650 2,5,17
Touch resistance 1 x E15
1 x E15
IPC-TM-650 2,5,17
Dielectric constant
4.0 3.0 MIL-P-55617
Coefficient of divergence 0.04 0.03 MIL-P-55617
Peel-off intensity
1.0kg f/cm
1.2kg f/cm
IPC-TM-650 2,4,9
Solder intensity 300 ℃/10 sec
210 ℃/10 sec
IPC-TM-650 2,4,9
Flammability
94VTM-0 94VTM-0
UL 94
MCPCB Production Capacity

Capability of MPCB
Material
Aluminum
Remark&Test
Layer count
1-2layer
 
Min track& width
0.1 mm (4mil)
百倍镜
最小孔径 钻孔
φ 0.40 mm
百倍镜
冲孔 φ 2.0 mm 百倍镜
最大钻杯 φ 8.00 mm MIL-P-55617
尺寸公差 导线宽度
± 20%
IPC-TM-650 2,4,9
孔径 ± 0.05 mm  
累积间距 ± 0.10 mm  
外形公差 ± 0.1 mm L ≤50 mm
边间距 ± 0.05 mm
C ≤5.0 mm
表面处理 化学镀金 Au(0.03-0.10 um);Ni(1-6 um) X-RAY 机
喷纯锡 Sn(6-18 um)
防氧化(OSP) 0.2-0.8um
焊接温度 满足无铅焊  

  Top