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Capability | |
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Xinyahong Technology Company is a Group company based in Hong Kong with facilities in mainland China, formed in 1995, started from punching tool manufacture. With year's development, we have been into an enterprise who supplies PCB, FPC and punching tool.
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Rigid PCB Production Capacity
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Item
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Mass Production
Capacity
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Layer Counts
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1~16 layer
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Material
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FR-4, High Tg FR-4，CEM-1,
CEM-3, FR-1,
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FR-2，XPC，Aluminum
Base, Teflon PTFE
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Material Mixed Laminate
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4 layers —8 layers
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Maximum Size
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610mm X 720mm
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Board Outline Tolerance
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±0.13mm
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Board Thickness
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0.40mm—3.20mm
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Thickness Tolerance
( t≥0.8mm)
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±8%
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Thickness Tolerance
( t＜0.8mm)
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±10%
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Insulation Layer Thickness
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0.10mm—6.00mm
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Minimum Line
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0.10mm
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Minimum Space
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0.10mm
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Out Layer Copper Thickness
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17um—140um
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Inner Layer Copper
Thickness
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17um—105um
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Drilling Hole (Mechanical)
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0.30mm—6.35mm
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Finish Hole (Mechanical)
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0.20mm—6.30mm
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Diameter Tolerance
(Mechanical)
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0.05mm
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Registration (Mechanical)
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0.075mm
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Laser Hole
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0.10mm (out source)
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Aspect Ratio
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10:1
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Solder Mask Type
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LPI, UV Cure
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SMT Mini. Solder Mask
Width
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0.10mm
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Mini. Solder Mask
Clearance
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0.05mm
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Plug Hole Diameter
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0.25mm—0.60mm
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Impedance Control
Tolerance
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±10%
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Surface Finish
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HASL, HASL Lead free,
Immersion Gold, OSP, Peelable mask,
Gold finger.
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Electrolytic Gold,
Immersion tin， Immersion Silver, Carbon
ink,
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Capability of Flexible circuits
| Material
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Polyimide (PI) Polyester
(PET)
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Remark
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Layer count
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1 up to 4 layer
1 up
to 2 layer
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Min track
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Single sided |
0.075mm (3mil)
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| Min space |
Double sided
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0.100mm (4mil)
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| Min
hole |
Drill
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0.3mm
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| Punch |
0.5mm
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| Dimension
Tolerance
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Track width (W)
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+/- 0.03mm
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W ≤ 0.5mm
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| Hole (H) |
+/- 0.05mm
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H ≤ 1.5mm
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| Pile distance (P) |
+/- 0.05mm
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P ≤ 25mm
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| Profile size (L) |
+/- 0.05mm
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L ≤50mm
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| Outline (C) |
+/- 0.075mm
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C ≤ 5.0mm
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Surface finish
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Hard Ni/Au (Au 0.05~1.25μm),
Pb/Tin (2~20μm), HASL (only for PI) |
| Copper weight |
9 μm, 12μm, 18μm, 35μm,
70μm |
Insolated resistance
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1000m ohm
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IPC-TM-650 2, 6, 3, 2 |
Dielectric intensity
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5 kv
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IPC-TM-650 2,5,6,1
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Surface resistance
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5 x E12
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2 x E15
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IPC-TM-650 2,5,17 |
| Touch resistance |
1 x E15
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1 x E15
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IPC-TM-650 2,5,17 |
Dielectric constant
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4.0 |
3.0 |
MIL-P-55617 |
| Coefficient of divergence |
0.04 |
0.03 |
MIL-P-55617 |
Peel-off intensity
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1.0kg f/cm
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1.2kg f/cm
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IPC-TM-650 2,4,9 |
| Solder intensity |
300 ℃/10 sec
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210 ℃/10 sec
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IPC-TM-650 2,4,9 |
Flammability
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94VTM-0 |
94VTM-0
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UL 94 |
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MCPCB Production Capacity
Capability of MPCB |
Material
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Aluminum
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Remark&Test |
Layer count
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1-2layer
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Min track& width
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0.1 mm (4mil)
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百倍镜 |
| 最小孔径 |
钻孔
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φ 0.40 mm
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百倍镜 |
| 冲孔 |
φ 2.0 mm |
百倍镜 |
| ****钻杯 |
φ 8.00 mm |
MIL-P-55617 |
| 尺寸公差 |
导线宽度
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± 20%
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IPC-TM-650 2,4,9 |
| 孔径 |
± 0.05 mm |
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| 累积间距 |
± 0.10 mm |
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| 外形公差 |
± 0.1 mm |
L ≤50 mm |
| 边间距 |
± 0.05 mm
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C ≤5.0 mm |
| 表面处理 |
化学镀金 |
Au(0.03-0.10 um);Ni(1-6 um) |
X-RAY 机 |
| 喷纯锡 |
Sn(6-18 um) |
| 防氧化（OSP） |
0.2-0.8um |
| 焊接温度 |
满足无铅焊 |
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